David William Lindbloom

City:

Lees Summit, Missouri

Country:

United States

Published Applications:

Last publication date:

2020-09-01

Top Assignees for applications by David William Lindbloom

The entities that hold a legal rights for patent applications filed by inventor Lindbloom David William:

Honeywell Federal Manufacturing & Technologies, LLC 1 Kansas City, MO United States

Recent patent applications by Lindbloom David William

David William Lindbloom from Lees Summit, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-09-01

US16545692

Electricity

Electronic connector sealing system

InventorID:

7131499 ⎘