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Inventor profile of:

Wei Kong

City:

Düsseldorf

Country:

Germany

Published Applications:

1

Last publication date:

2025-07-10

Recent patent applications by Kong Wei

Wei Kong from Düsseldorf, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-07-10

US20250223475A1

Chemistry; metallurgy

Hot Melt Adhesive Composition for Secured Paper Packaging

InventorID:

7150133 ⎘