Benjamin A. Dietsch

City:

Dayton, Ohio

Country:

United States

Published Applications:

Last publication date:

2019-01-01

Top Assignees for applications by Benjamin A. Dietsch

The entities that hold a legal rights for patent applications filed by inventor Dietsch Benjamin A.:

Benjamin A. Dietsch from Dayton, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Hybrid fiber layup and fiber-reinforced polymeric composites produced therefrom

Hybrid fiber layup and fiber-reinforced polymeric composites produced therefrom

InventorID:

7159775 ⎘