Jin-Fu Yeh

City:

Pasadena, California

Country:

United States

Published Applications:

Last publication date:

2017-04-25

Top Assignees for applications by Jin-Fu Yeh

The entities that hold a legal rights for patent applications filed by inventor Yeh Jin-Fu:

Jin-Fu Yeh from Pasadena, US has applied for patents for these inventions. The list has both pending applications and granted patents:

3D packaging of power amplifier dice apparatus and articles of manufacture

InventorID:

7180386 ⎘