Guy N. Smith

City:

Cedar Rapids, Iowa

Country:

United States

Published Applications:

Last publication date:

2017-01-10

Top Assignees for applications by Guy N. Smith

The entities that hold a legal rights for patent applications filed by inventor Smith Guy N.:

Guy N. Smith from Cedar Rapids, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Shielding encapsulation for electrical circuitry

PCB external ground plane via conductive coating

Low modulus stress buffer coating in microelectronic devices

InventorID:

7183731 ⎘