John William Eichelberg

City:

Seattle, Washington

Country:

United States

Published Applications:

Last publication date:

2016-05-03

Top Assignees for applications by John William Eichelberg

The entities that hold a legal rights for patent applications filed by inventor Eichelberg John William:

AMAZON TECHNOLOGIES, INC. 1 Reno, NV United States

Recent patent applications by Eichelberg John William

John William Eichelberg from Seattle, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-05-03

US13682641

Electricity

Data center module with leveling pad

InventorID:

7196128 ⎘