Meridian, Idaho
United States
19
2024-08-22
The entities that hold a legal rights for patent applications filed by inventor Pratt Dave:
Dave Pratt from Meridian, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Assemblies having Conductive Interconnects which are Laterally and Vertically Offset Relative to One Another
#2 | 2023-02-23Conductive Interconnects and Methods of Forming Conductive Interconnects
#3 | 2023-01-19Assemblies having conductive interconnects which are laterally and vertically offset relative to one another and methods of forming assemblies having conductive interconnects which are laterally and vertically offset relative to one another
#4 | 2022-06-23Conductive interconnects and methods of forming conductive interconnects
#5 | 2022-01-13Assemblies having conductive interconnects which are laterally and vertically offset relative to one another
#6 | 2021-08-12Conductive interconnects and methods of forming conductive interconnects
#7 | 2021-06-24Conductive interconnects and methods of forming conductive interconnects
#8 | 2017-09-07Methods of forming through substrate interconnects
#9 | 2015-03-26Methods of forming through substrate interconnects
#10 | 2014-04-10Methods of forming through substrate interconnects
#11 | 2012-11-15Die stacking with an annular via having a recessed socket
#12 | 2012-01-26Methods of forming through substrate interconnects
#13 | 2011-09-22Die stacking with an annular via having a recessed socket
#14 | 2011-08-25Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside
#15 | 2011-02-10Die stacking with an annular via having a recessed socket
#16 | 2009-10-22Die stacking with an annular via having a recessed socket
#17 | 2009-10-15Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking
#18 | 2009-02-19Methods of forming through substrate interconnects
#19 | 2007-11-22Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices
719618 ⎘