Asami Doi

City:

Ibaraki-shi

Country:

Japan

Published Applications:

Last publication date:

2014-04-10

Top Assignees for applications by Asami Doi

The entities that hold a legal rights for patent applications filed by inventor Doi Asami:

NITTO DENKO CORPORATION 1 Ibaraki-shi, Osaka, Japan

Recent patent applications by Doi Asami

Asami Doi from Ibaraki-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-04-10

US20140100335A1

Chemistry; metallurgy

POLYMER COMPOSITION, ADHESIVE COMPOSITION, TEMPERATURE-RESPONSIVE SHEET PRODUCED USING SAID POLYMER COMPOSITION, AND COLD-RELEASE ADHESIVE SHEET PRODUCED USING SAID ADHESIVE COMPOSITION

InventorID:

720348 ⎘