Inventor profile of:

William C. Leck

City:

Arvada, Colorado

Country:

United States

Published Applications:

3

Last publication date:

2014-08-26

Top Assignees for applications by William C. Leck

The entities that hold a legal rights for patent applications filed by inventor Leck William C.:

  • Avaya Inc 3 Basking Ridge, NJ United States

Recent patent applications by Leck William C.

William C. Leck from Arvada, US has applied for patents for these inventions. The list has both pending applications and granted patents:

InventorID:

7214423 ⎘