Man Kit Mui

City:

Kowloon

Country:

Hong Kong

Published Applications:

Last publication date:

2013-05-07

Top Assignees for applications by Man Kit Mui

The entities that hold a legal rights for patent applications filed by inventor Mui Man Kit:

Man Kit Mui from Kowloon, HK has applied for patents for these inventions. The list has both pending applications and granted patents:

Universal bond head for wire bonders

Wedge bonding method incorporating remote pattern recognition system

InventorID:

7228056 ⎘