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Inventor profile of:

Bernd Roelfs

City:

Berlin

Country:

Germany

Published Applications:

7

Last publication date:

2016-09-15

Top Assignees for applications by Bernd Roelfs

The entities that hold a legal rights for patent applications filed by inventor Roelfs Bernd:

  • ATOTECH DEUTSCHLAND GMBH 6 Berlin, Germany

Recent patent applications by Roelfs Bernd

Bernd Roelfs from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-09-15
US20160270241A1
Electricity

Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

#2 | 2015-10-22
US20150299883A1
Chemistry; metallurgy

Copper plating bath composition

#3 | 2015-01-15
US20150014177A1
Chemistry; metallurgy

METHOD FOR PRODUCING MATT COPPER DEPOSITS

#4 | 2014-04-17
US20140102910A1
Chemistry; metallurgy

Method for copper plating

#5 | 2011-01-20
US20110011746A1
Chemistry; metallurgy

Aqueous, acid bath and method for the electrolytic deposition of copper

#6 | 2009-12-10
US20090301889A1
Electricity

Electrolytic method for filling holes and cavities with metals

#7 | 2009-09-24
US20090236230A1
Electricity

Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

InventorID:

723684 ⎘

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