Michael D. Cusack

City:

Meridian, Idaho

Country:

United States

Published Applications:

Last publication date:

2012-09-18

Top Assignees for applications by Michael D. Cusack

The entities that hold a legal rights for patent applications filed by inventor Cusack Michael D.:

Michael D. Cusack from Meridian, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Multichip package leadframe including electrical bussing

Leadframe including die paddle apertures for reducing delamination

Multichip package leadframe including electrical bussing

InventorID:

7240273 ⎘