Sunnyvale, California
United States
4
2012-07-03
The entities that hold a legal rights for patent applications filed by inventor Euzent Bruce:
Bruce Euzent from Sunnyvale, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate
#2 | 2010-06-22Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate
#3 | 2009-09-08Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate
#4 | 2007-04-24Apparatus and methods for assessing reliability of assemblies using programmable logic devices
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