Betchworth
United Kingdom
11
2016-06-02
The entities that hold a legal rights for patent applications filed by inventor Cutler Daniel:
Daniel Cutler from Betchworth, GB has applied for patents for these inventions. The list has both pending applications and granted patents:
Method for fabricating a semiconductor package with conductive carrier integrated heat spreader
#2 | 2016-02-04Power semiconductor package having vertically stacked driver IC
#3 | 2016-01-28Method for fabricating a power semiconductor package including vertically stacked driver IC
#4 | 2015-12-03Semiconductor Package with Integrated Heat Spreader
#5 | 2015-12-03Method for fabricating a semiconductor package with conductive carrier integrated heat spreader
#6 | 2015-08-06Surface mountable power components
#7 | 2014-04-24Power converter package including vertically stacked driver IC
#8 | 2014-04-24Semiconductor package with conductive carrier integrated heat spreader
#9 | 2014-04-24Power converter package including top-drain configured power FET
#10 | 2014-04-24Semiconductor package including conductive carrier coupled power switches
#11 | 2014-04-17Surface mountable power components
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