Sang-do Lee

City:

Bucheon

Country:

South Korea

Published Applications:

Last publication date:

2011-11-15

Top Assignees for applications by Sang-do Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Sang-do:

Sang-do Lee from Bucheon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Wafer-level chip scale package having stud bump and method for fabricating the same

InventorID:

7249397 ⎘