Michael Bauer

City:

Regensburg

Country:

Germany

Published Applications:

Last publication date:

2008-09-02

Top Assignees for applications by Michael Bauer

The entities that hold a legal rights for patent applications filed by inventor Bauer Michael:

Michael Bauer from Regensburg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Electronic component and semiconductor wafer, and method for producing the same

Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module

InventorID:

7264625 ⎘