Brian E. Curcio

City:

Binghamton, New York

Country:

United States

Published Applications:

Last publication date:

2008-07-22

Top Assignees for applications by Brian E. Curcio

The entities that hold a legal rights for patent applications filed by inventor Curcio Brian E.:

Brian E. Curcio from Binghamton, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method and structure for producing Z-axis interconnection assembly of printed wiring board elements

Solid via layer to layer interconnect

InventorID:

7267367 ⎘