Vincent Hool

City:

Fremont, California

Country:

United States

Published Applications:

Last publication date:

2008-06-24

Top Assignees for applications by Vincent Hool

The entities that hold a legal rights for patent applications filed by inventor Hool Vincent:

Vincent Hool from Fremont, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Techniques for flip chip package migration

Method of designing a module-based flip chip substrate design

Bypass capacitor embedded flip chip package lid and stiffener

Post-passivation thick metal pre-routing for flip chip packaging

InventorID:

7269574 ⎘