Leisa A. Ryan

City:

Windsor

Country:

United Kingdom

Published Applications:

Last publication date:

2008-04-01

Top Assignees for applications by Leisa A. Ryan

The entities that hold a legal rights for patent applications filed by inventor Ryan Leisa A.:

Leisa A. Ryan from Windsor, GB has applied for patents for these inventions. The list has both pending applications and granted patents:

Multi-layer film packaging of hot melt adhesive

InventorID:

7276794 ⎘