San Jose, California
United States
15
2019-08-08
The entities that hold a legal rights for patent applications filed by inventor Wu Scott:
Scott Wu from San Jose, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Methods and Apparatus for Testing an Integrated Circuit
#2 | 2018-12-13Multi-test type probe card and corresponding testing system for parallel testing of dies via multiple test sites
#3 | 2016-06-02Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate
#4 | 2015-10-29SEMICONDUCTOR PACKAGE WITH A SEMICONDUCTOR DIE EMBEDDED WITHIN SUBSTRATES
#5 | 2015-10-01Recessed semiconductor substrates and associated techniques
#6 | 2015-08-13Method and apparatus for improving the reliability of a connection to a via in a substrate
#7 | 2014-05-15Heat sink blade pack for device under test testing
#8 | 2014-05-08TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES
#9 | 2014-04-17Structures embedded within core material and methods of manufacturing thereof
#10 | 2012-03-01Structures embedded within core material and methods of manufacturing thereof
#11 | 2011-09-22Embedded die with protective interposer
#12 | 2011-08-04Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate
#13 | 2011-08-04Recessed semiconductor substrates and associated techniques
#14 | 2011-08-04TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES
#15 | 2011-05-26Semiconductor package with a semiconductor die embedded within substrates
728041 ⎘