Summerfield, North Carolina
United States
12
2020-04-02
The entities that hold a legal rights for patent applications filed by inventor Jandzinski David:
David Jandzinski from Summerfield, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Wafer-level package with enhanced performance and manufacturing method thereof
#2 | 2019-04-04Double-sided module with electromagnetic shielding
#3 | 2017-11-23Wafer-level package with enhanced performance
#4 | 2016-11-24Flip chip module with enhanced properties
#5 | 2016-09-29Encapsulated dies with enhanced thermal performance
#6 | 2016-09-29Encapsulated dies with enhanced thermal performance
#7 | 2014-05-29SURFACE FINISH FOR CONDUCTIVE FEATURES ON SUBSTRATES
#8 | 2014-04-17Additive conductor redistribution layer (ACRL)
#9 | 2011-09-22Conformal shielding employing segment buildup
#10 | 2010-08-12CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP
#11 | 2009-01-01Conformal shielding process using flush structures
#12 | 2009-01-01CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP
728097 ⎘