Shingo Masuko

City:

Suzaka

Country:

Japan

Published Applications:

Last publication date:

2007-12-04

Top Assignees for applications by Shingo Masuko

The entities that hold a legal rights for patent applications filed by inventor Masuko Shingo:

Shingo Masuko from Suzaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Package for electronic device, base substrate, electronic device and fabrication method thereof

Method of packaging electronic parts

InventorID:

7287435 ⎘