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Inventor profile of:

Keiichi Kimura

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-04-30

Top Assignees for applications by Keiichi Kimura

The entities that hold a legal rights for patent applications filed by inventor Kimura Keiichi:

NIPPON STEEL MATERIALS CO, LTD. 7 Tokyo, Japan
NIPPON MICROMETAL CORPORATION 4 Saitama, Japan
NIPPON STEEL CORPORATION 4 Tokyo, Japan
NIPPON STEEL & SUMITOMO METAL CORPORATION 4 Tokyo, Japan
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. 3 Tokyo, Japan
NIPPON STEEL & SUMITOMO METAL CORPORATION 2 Tokyo, Japan
NIPPON MICROMETAL CORPORATION 2 Iruma-shi, Saitama, Japan
Nippon Steel & Sumikin Materials Co., Ltd. 2 Tokyo, Japan
Nippon Micrometal Corporation 2 Iruma, Japan
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. 1 Tokyo, Japan
Toshiba Digital Solutions Corporation 1 Kawasaki-shi, Japan
ICHIKAWA CO., LTD. 1 Tokyo, Japan
Nippon Micrometal Corporation 1 Tokyo, Japan
NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. 1 TOKYO, Japan
Nippon Steel & Sumikin Chemical Co., Ltd. 1 Tokyo, Japan
Revorf Co., Ltd 1 Tokyo, Japan

Recent patent applications by Kimura Keiichi

Keiichi Kimura from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-04-30

US20260120794A1

Physics

ALLOSTERIC PATH PREDICTION DEVICE, ALLOSTERIC PATH PREDICTION RESULT ACQUISITION METHOD, AND ALLOSTERIC PATH PREDICTION METHOD

#2 | 2025-05-01

US20250143139A1

Electricity

TITANIUM ALLOY FOIL, DISPLAY PANEL, AND METHOD FOR MANUFACTURING DISPLAY PANEL

#3 | 2024-05-09

US20240150880A1

Chemistry; metallurgy

FLEXIBLE STAINLESS STEEL FOIL AND FLEXIBLE LIGHT EMITTING DEVICE

#4 | 2023-12-21

US20230407427A1

Chemistry; metallurgy

AUSTENITIC STAINLESS STEEL FOIL

#5 | 2021-04-08

US20210101840A1

Chemistry; metallurgy

COMPOSITE CERAMIC LAYERED BODY AND MANUFACTURING METHOD

#6 | 2020-03-05

US20200071836A1

Chemistry; metallurgy

Ceramic laminate, ceramic insulating substrate, and method for manufacturing ceramic laminate

#7 | 2019-03-28

US20190093082A1

Chemistry; metallurgy

Method of Differentiating Pluripotent Stem Cells

#8 | 2019-02-28

US20190062923A1

Chemistry; metallurgy

Ceramic laminate

#9 | 2017-11-16

US20170332489A1

Electricity

Oriented copper plate, copper-clad laminate, flexible circuit board, and electronic device

#10 | 2014-09-11

US20140254114A1

Electricity

FLEXIBLE CIRCUIT BOARD AND METHOD FOR PRODUCING SAME AND BEND STRUCTURE OF FLEXIBLE CIRCUIT BOARD

#11 | 2014-04-24

US20140109962A1

Electricity

INTERCONNECTOR FOR SOLAR CELLS, AND SOLAR CELL MODULE

#12 | 2013-01-10

US20130008692A1

Chemistry; metallurgy

Metal tape material and interconnector for solar module current collection

#13 | 2012-05-03

US20120104613A1

Electricity

Bonding wire for semiconductor device

#14 | 2011-06-09

US20110132643A1

Electricity

Flexible circuit board and method for producing same and bend structure of flexible circuit board

#15 | 2011-01-20

US20110011619A1

Chemistry; metallurgy

Bonding wire for semiconductor devices

#16 | 2011-01-20

US20110011618A1

Electricity

Copper alloy bonding wire for semiconductor device

#17 | 2010-12-30

US20100327450A1

Electricity

Semiconductor device bonding wire and wire bonding method

#18 | 2010-11-25

US20100294532A1

Chemistry; metallurgy

Bonding wire for semiconductor devices

#19 | 2010-11-11

US20100282495A1

Chemistry; metallurgy

Bonding wire for semiconductor device

#20 | 2008-03-13

US20080061440A1

Electricity

Copper alloy bonding wire for semiconductor device

#21 | 2006-11-30

US20060266490A1

Textiles; paper

Shoe press mechanism of paper machine

#22 | 2005-08-16

US10607397

Shoe press belt

InventorID:

732620 ⎘