Hideki Niimi

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2024-06-27

Top Assignees for applications by Hideki Niimi

The entities that hold a legal rights for patent applications filed by inventor Niimi Hideki:

Hideki Niimi from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

Wiring board and method for producing the same

Semiconductor device having semiconductor package in a wiring board opening

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

InventorID:

732865 ⎘