Daniel Richter

City:

Radebeul

Country:

Germany

Published Applications:

Last publication date:

2014-04-24

Top Assignees for applications by Daniel Richter

The entities that hold a legal rights for patent applications filed by inventor Richter Daniel:

Daniel Richter from Radebeul, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor dies with reduced area consumption

Substrate dicing technique for separating semiconductor dies with reduced area consumption

Efficient method of forming and assembling a microelectronic chip including solder bumps

InventorID:

733709 ⎘