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Inventor profile of:

Kazuto OGAWA

City:

Mie

Country:

Japan

Published Applications:

2

Last publication date:

2026-06-04

Recent patent applications by OGAWA Kazuto

Kazuto OGAWA from Mie, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-06-04

US20260157227A1

SEMICONDUCTOR ENCAPSULATING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

#2 | 2025-08-07

US20250250458A1

Chemistry; metallurgy

ENCAPSULATION EPOXY RESIN COMPOSITION AND ELECTRONIC DEVICE

InventorID:

7342736 ⎘