Baker MA

City:

Nanjing

Country:

China

Published Applications:

Last publication date:

2025-08-14

Top Assignees for applications by Baker MA

The entities that hold a legal rights for patent applications filed by inventor MA Baker:

Baker MA from Nanjing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD FOR CHIP PACKAGING WITH HIGH-DENSITY CONNECTION LAYER, AND CHIP PACKAGING STRUCTURE

InventorID:

7354975 ⎘