Inventor profile of:

Masato MORI

City:

Osaka

Country:

Japan

Published Applications:

14

Last publication date:

2024-02-15

Top Assignees for applications by Masato MORI

The entities that hold a legal rights for patent applications filed by inventor MORI Masato:

Recent patent applications by MORI Masato

Masato MORI from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-02-15
US20240051135A1
Performing operations; transporting

INTERFERENCE DETERMINATION DEVICE, ROBOT CONTROL SYSTEM, AND METHOD FOR DETERMINING INTERFERENCE

#2 | 2023-09-21
US20230294292A1
Performing operations; transporting

ROBOT CONTROL APPARATUS, ROBOT CONTROL SYSTEM, AND METHOD FOR CONTROLLING ROBOT

#3 | 2019-06-27
US20190196371A1
Physics

Image forming apparatus controlling actual temperature of fixing part based on target temperature and cumulative deviation of actual temperature

#4 | 2017-10-26
US20170308333A1
Physics

Printer-end page sequencing of document pages multipage-captured by portal terminal

#5 | 2017-01-26
US20170026527A1
Electricity

Image forming apparatus with settable printing speed and image formation system

#6 | 2014-04-24
US20140112676A1
Physics

Image forming apparatus

#7 | 2009-12-31
US20090321122A1
Electricity

Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate

#8 | 2009-10-29
US20090268423A1
Electricity

Interconnect substrate and electronic circuit mounted structure

#9 | 2009-08-27
US20090215287A1
Electricity

Substrate connecting member and connecting structure

#10 | 2009-07-09
US20090173795A1
Electricity

Card type information device and method for manufacturing same

#11 | 2009-01-08
US20090009979A1
Electricity

Substrate joining member and three-dimensional structure using the same

#12 | 2008-06-12
US20080139013A1
Electricity

Interconnecting board and three-dimensional wiring structure using it

#13 | 2007-07-19
US20070164079A1
Electricity

Electronic component mounting method, and circuit substrate and circuit substrate unit used in the method

#14 | 2007-06-28
US20070145575A1
Electricity

Circuit board and method for mounting chip component

InventorID:

735656 ⎘