Berlin
Germany
29
2025-12-18
The entities that hold a legal rights for patent applications filed by inventor Wilke Klaus:
Klaus Wilke from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Power Electronics Assembly Comprising Power Modules That Can Be Fitted with Components
#2 | 2024-02-01Device Comprising a Component and a Coupled Cooling Body
#3 | 2023-07-06Joining and Insulating Power Electronic Semiconductor Components
#4 | 2023-06-15TOLERANCE COMPENSATION ELEMENT FOR CIRCUIT CONFIGURATIONS
#5 | 2022-10-20Semifinished Product for Populating with Components and, Method for Populating Same with Components
#6 | 2022-09-08Installing an Electronic Assembly
#7 | 2022-06-02SOLDERING MATERIAL BASED ON SN AG AND CU
#8 | 2021-11-11Circuit Carrier Having an Installation Place for Electronic Components, Electronic Circuit and Production Method
#9 | 2021-08-05Power electronic circuit having a plurality of power modules
#10 | 2021-06-10CONNECTING ELECTRICAL COMPONENTS
#11 | 2021-05-27Vibration-damped circuit arrangement, converter, and aircraft having such an arrangement
#12 | 2021-05-20Power module having a power electronics device on a substrate board, and power electronics circuit having such a power module
#13 | 2021-04-01CREATION OF AN ELECTRICAL CONNECTION BETWEEN COMPONENTS AND A CONTACTING PLATE
#14 | 2021-03-25Capacitor structure and power module having a power electronic component
#15 | 2021-01-21CIRCUIT ARRANGEMENT HAVING A SPACER ELEMENT, CONVERTER AND AIRCRAFT WITH SUCH A CIRCUIT ARRANGEMENT, AND METHOD FOR CURRENT MEASUREMENT
#16 | 2021-01-14Solder alloy for power devices and solder joint having a high current density
#17 | 2020-05-28Electrical assembly
#18 | 2020-05-21Semiconductor component and method for producing same
#19 | 2020-05-14Electronic Assembly With a Component Located Between Two Substrates, and Method for Producing Same
#20 | 2020-05-14Solder preform for establishing a diffusion solder connection and method for producing a solder preform
#21 | 2020-05-07Solder Preform for Diffusion Soldering, Method for the Production thereof, and Method for the Assembly Thereof
#22 | 2020-04-23TOLERANCE COMPENSATION ELEMENT FOR CIRCUIT CONFIGURATIONS
#23 | 2020-01-23Soldering material based on Sn Ag and Cu
#24 | 2019-06-20Electronic assembly with a component arranged between two circuit carriers, and method for joining such an assembly
#25 | 2017-04-27Method for mounting an electrical component, wherein a hood is used, and hood suitable for use in said method
#26 | 2017-02-02Method for mounting an electrical component in which a hood is used, and a hood that is suitable for use in this method
#27 | 2016-07-28Method for the diffusion soldering of an electronic component to a substrate
#28 | 2014-04-24Solder Alloy for Power Devices and Solder Joint Having a High Current Density
#29 | 2007-02-15Soldering material based on Sn Ag and Cu
735700 ⎘