Toshitada Netsu

City:

Hadano

Country:

Japan

Published Applications:

Last publication date:

2009-04-14

Top Assignees for applications by Toshitada Netsu

The entities that hold a legal rights for patent applications filed by inventor Netsu Toshitada:

Toshitada Netsu from Hadano, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Sealing structure for multi-chip module

Device for sealing and cooling multi-chip modules

InventorID:

7367947 ⎘