Wolfgang Hechtl

City:

München

Country:

Germany

Published Applications:

Last publication date:

2007-01-02

Top Assignees for applications by Wolfgang Hechtl

The entities that hold a legal rights for patent applications filed by inventor Hechtl Wolfgang:

Wolfgang Hechtl from München, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Device for removing an injection molded substrate from an injection mold

InventorID:

7379924 ⎘