Ho-eun Bae

City:

Gyeongsangnam-do

Country:

South Korea

Published Applications:

Last publication date:

2014-05-01

Top Assignees for applications by Ho-eun Bae

The entities that hold a legal rights for patent applications filed by inventor Bae Ho-eun:

Electronics and Telecommunications Research Institute 1 Daejeon, South Korea

Recent patent applications by Bae Ho-eun

Ho-eun Bae from Gyeongsangnam-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-05-01

US20140117070A1

Performing operations; transporting

Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same

InventorID:

741669 ⎘