Chengdu
China
12
2026-05-07
The entities that hold a legal rights for patent applications filed by inventor Fu Daping:
Daping Fu from Chengdu, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE WITH IMPROVED BREAKDOWN VOLTAGE AND ASSOCIATED MANUFACTURING METHOD
#2 | 2026-05-07SEMICONDUCTOR DEVICE WITH IMPROVED BREAKDOWN VOLTAGE AND ASSOCIATED MANUFACTURING METHOD
#3 | 2025-11-06LDMOS HAVING MULTIPLE FIELD PLATES AND ASSOCIATED MANUFACTURING METHOD
#4 | 2023-08-17SEMICONDUCTOR DEVICE WITH LOW PINCH-OFF VOLTAGE AND METHODS FOR MANUFACTURING THE SAME
#5 | 2021-06-24LATERAL TRANSISTOR WITH LATERAL CONDUCTIVE FIELD PLATE OVER A FIELD PLATE POSITIONING LAYER
#6 | 2021-05-27Lateral DMOS with integrated Schottky diode
#7 | 2020-06-11Lateral schottky diode with high breakdown voltage capability
#8 | 2017-06-29Bipolar junction semiconductor device and method for manufacturing thereof
#9 | 2017-06-15HIGH VOLTAGE DMOS AND THE METHOD FOR FORMING THEREOF
#10 | 2015-01-01High side DMOS and the method for forming thereof
#11 | 2014-05-01SEMICONDUCTOR DEVICE AND ASSOCIATED METHOD FOR MANUFACTURING
#12 | 2014-05-01Junction field effect transistors and associated fabrication methods
742106 ⎘