Hsinchu
Taiwan
42
2026-05-14
The entities that hold a legal rights for patent applications filed by inventor CHEN Xiaomeng:
Xiaomeng CHEN from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
DEFECT REPAIRING APPARATUSES AND METHODS OF REPAIRING DEFECTS
#2 | 2026-04-30APPARATUS AND METHOD FOR IMPROVED ELECTRON BEAM INSPECTION WITH A CHARGE TREATMENT ELECTRON SOURCE
#3 | 2026-04-09INSPECTION APPARATUS AND INSPECTION METHOD
#4 | 2026-03-05APPARATUS AND METHOD FOR IMPROVED ELECTRON BEAM INSPECTION WITH PROGRAMMABLE ANGLE AND ENERGY DETECTION
#5 | 2026-02-12APPARATUS AND METHOD FOR IMPROVED ELECTRON MULTI-BEAM INSPECTION
#6 | 2024-10-31SIMULTANEOUS MULTI-BANDWIDTH OPTICAL INSPECTION OF SEMICONDUCTOR DEVICES
#7 | 2024-08-08SEMICONDUCTOR STRUCTURE INSPECTION USING A HIGH ATOMIC NUMBER MATERIAL
#8 | 2024-05-30DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING
#9 | 2023-12-21Simultaneous multi-bandwidth optical inspection of semiconductor devices
#10 | 2022-09-22Semiconductor structure inspection using a high atomic number material
#11 | 2021-09-30Dual facing BSI image sensors with wafer level stacking
#12 | 2020-02-13Dual facing BSI image sensors with wafer level stacking
#13 | 2018-08-09Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same
#14 | 2017-11-02Dual facing BSI image sensors with wafer level stacking
#15 | 2016-04-21Method of manufacturing a semiconductor device including a barrier structure
#16 | 2015-12-10Hybrid bonding mechanisms for semiconductor wafers
#17 | 2015-10-08Method of manufacturing a semiconductor device
#18 | 2015-10-08Silicon dot formation by self-assembly method and selective silicon growth for flash memory
#19 | 2015-07-02Semiconductor arrangement with capacitor and method of fabricating the same
#20 | 2015-05-28Semiconductor arrangement with capacitor
#21 | 2015-05-28Semiconductor arrangment with capacitor
#22 | 2015-04-30Semiconductor arrangement having capacitor separated from active region
#23 | 2015-04-09Semiconductor device with non-linear surface
#24 | 2015-04-09Semiconductor device with non-linear surface
#25 | 2015-04-02Dual facing BSI image sensors with wafer level stacking
#26 | 2015-03-12Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method
#27 | 2015-03-05Crystalline layer for passivation of III-N surface
#28 | 2015-03-05Gallium nitride transistor with a hybrid aluminum oxide layer as a gate dielectric
#29 | 2015-02-26Silicon dot formation by direct self-assembly method for flash memory
#30 | 2015-02-26Silicon dot formation by self-assembly method and selective silicon growth for flash memory
#31 | 2015-02-26Semiconductor device
#32 | 2015-02-26Transistor having an ohmic contact by gradient layer and method of making the same
#33 | 2015-02-26Transistor having an ohmic contact by screen layer and method of making the same
#34 | 2015-02-12Semiconductor device, high electron mobility transistor (HEMT) and method of manufacturing
#35 | 2015-02-12Backside illuminated photo-sensitive device with gradated buffer layer
#36 | 2015-01-22TRANSISTOR HAVING PARTIALLY OR WHOLLY REPLACED SUBSTRATE AND METHOD OF MAKING THE SAME
#37 | 2015-01-22Transistor having high breakdown voltage and method of making the same
#38 | 2015-01-22Transistor having a back-barrier layer and method of making the same
#39 | 2014-12-02Transistor having doped substrate and method of making the same
#40 | 2014-08-26Plasmonic nanostructures for organic image sensors
#41 | 2014-05-01Hybrid bonding mechanisms for semiconductor wafers
#42 | 2014-04-03Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same
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