William Bond

City:

Cary, Illinois

Country:

United States

Published Applications:

Last publication date:

2006-04-18

Top Assignees for applications by William Bond

The entities that hold a legal rights for patent applications filed by inventor Bond William:

William Bond from Cary, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Heat pipe cooled electronics enclosure

InventorID:

7433260 ⎘