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Inventor profile of:

Daimon Ueda

City:

Osaka

Country:

Japan

Published Applications:

1

Last publication date:

2006-02-21

Top Assignees for applications by Daimon Ueda

The entities that hold a legal rights for patent applications filed by inventor Ueda Daimon:

LAMI CORPORATION INC. 1 Osaka, Japan

Recent patent applications by Ueda Daimon

Daimon Ueda from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-02-21

US10081881

Lamination apparatus

InventorID:

7446510 ⎘