Timothy V. Harper

City:

Boise, Idaho

Country:

United States

Published Applications:

Last publication date:

2006-02-21

Top Assignees for applications by Timothy V. Harper

The entities that hold a legal rights for patent applications filed by inventor Harper Timothy V.:

Timothy V. Harper from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Integrated circuit package employing flip-chip technology and method of assembly

Apparatus for routing signals

InventorID:

7447235 ⎘