Hemantha Kumar Wickramasinghe

City:

Chappaqua, New York

Country:

United States

Published Applications:

Last publication date:

2006-01-03

Top Assignees for applications by Hemantha Kumar Wickramasinghe

The entities that hold a legal rights for patent applications filed by inventor Wickramasinghe Hemantha Kumar:

Hitachi Global Storage Technologies Netherlands B.V. 1 Amsterdam, Netherlands
INTERNATIONAL BUSINESS MACHINES CORPORATION 1 ARMONK, NY United States

Recent patent applications by Wickramasinghe Hemantha Kumar

Hemantha Kumar Wickramasinghe from Chappaqua, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-01-03

US9931834

Assembly comprising adjustable heat flux mechanism for thermally assisted/thermal information processing and control

#2 | 2005-07-19

US9774943

Assembly for writing and/or erasing high density data on a media

InventorID:

7457383 ⎘