Daniel B. McGowen

City:

Naperville, Illinois

Country:

United States

Published Applications:

Last publication date:

2005-12-27

Top Assignees for applications by Daniel B. McGowen

The entities that hold a legal rights for patent applications filed by inventor McGowen Daniel B.:

Molex Incorporated 1 Lisle, IL United States

Recent patent applications by McGowen Daniel B.

Daniel B. McGowen from Naperville, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-12-27

US10306094

High-density connector assembly with flexural capabilities

InventorID:

7458070 ⎘