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Inventor profile of:

Shingo Komatsu

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2013-02-07

Top Assignees for applications by Shingo Komatsu

The entities that hold a legal rights for patent applications filed by inventor Komatsu Shingo:

PANASONIC CORPORATION 11 Osaka, Japan
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 3 Osaka, Japan
Matsushita Electric Industrial Co., Ltd. 1 Kadoma, Japan
DAI-ICHI KOGYO SEIYAKU CO., LTD. 1 Kyoto, Japan

Recent patent applications by Komatsu Shingo

Shingo Komatsu from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-02-07

US20130032797A1

Electricity

Field-effect transistor and method for manufacturing the same

#2 | 2011-03-03

US20110049598A1

Electricity

Manufacturing method of flexible semiconductor device and flexible semiconductor device

#3 | 2010-11-04

US20100276691A1

Electricity

Method for making a semiconductor device on a flexible substrate

#4 | 2010-09-09

US20100224986A1

Electricity

Mounted body and method for manufacturing the same

#5 | 2010-01-21

US20100012936A1

Electricity

Manufacturing method of flexible semiconductor device and flexible semiconductor device

#6 | 2009-12-31

US20090321124A1

Electricity

Semiconductor device and manufacturing process thereof

#7 | 2009-09-17

US20090230546A1

Electricity

Mounted body and method for manufacturing the same

#8 | 2009-09-10

US20090223705A1

Electricity

Electronic component mounting method

#9 | 2008-10-16

US20080251894A1

Electricity

Mounted body and method for manufacturing the same

#10 | 2008-08-21

US20080197173A1

Electricity

Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition

#11 | 2008-06-05

US20080128664A1

Electricity

Flip-chip mounting resin composition and bump forming resin composition

#12 | 2005-03-29

US9778709

Transfer material for wiring substrate

InventorID:

74664 ⎘