Raymond J. Adamic

City:

Corvallis, Oregon

Country:

United States

Published Applications:

Last publication date:

2005-09-27

Top Assignees for applications by Raymond J. Adamic

The entities that hold a legal rights for patent applications filed by inventor Adamic Raymond J.:

Hewlett-Packard Development Company, L.P. 1 Houston, TX United States

Recent patent applications by Adamic Raymond J.

Raymond J. Adamic from Corvallis, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-09-27

US10117648

Fluid interconnect with sealant

InventorID:

7474598 ⎘