Neil Robert McLellan

City:

Mid Levels

Country:

Hong Kong

Published Applications:

Last publication date:

2005-09-06

Top Assignees for applications by Neil Robert McLellan

The entities that hold a legal rights for patent applications filed by inventor McLellan Neil Robert:

ASAT Limited 1 Tsuen Wan, Hong Kong

Recent patent applications by McLellan Neil Robert

Neil Robert McLellan from Mid Levels, HK has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-09-06

US10178372

Integrated circuit package and method of manufacturing the integrated circuit package

InventorID:

7482189 ⎘