Ron Boja

City:

Gilroy, California

Country:

United States

Published Applications:

Last publication date:

2015-03-19

Top Assignees for applications by Ron Boja

The entities that hold a legal rights for patent applications filed by inventor Boja Ron:

Ron Boja from Gilroy, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad

Absorbing excess under-fill flow with a solder trench

Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity

NON-SOLDER MASK DEFINED COPPER PAD AND EMBEDDED COPPER PAD TO REDUCE PACKAGING SYSTEM HEIGHT

InventorID:

750238 ⎘