Daniel Smith

City:

Boise, Idaho

Country:

United States

Published Applications:

Last publication date:

2005-05-17

Top Assignees for applications by Daniel Smith

The entities that hold a legal rights for patent applications filed by inventor Smith Daniel:

Daniel Smith from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor devices having contact plugs and local interconnects and methods for making the same

InventorID:

7509965 ⎘