Eau Claire, Wisconsin
United States
4
2014-05-08
The entities that hold a legal rights for patent applications filed by inventor Scheid David:
David Scheid from Eau Claire, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Integrated circuit package including wire bond and electrically conductive adhesive electrical connections
#2 | 2011-07-28Multi-tiered integrated circuit package
#3 | 2010-12-09Integrated circuit package including a thermally and electrically conductive package lid
#4 | 2010-10-28Dual-dual lockstep processor assemblies and modules
751061 ⎘