Shingo Ohsaka

City:

Hakodate

Country:

Japan

Published Applications:

Last publication date:

2005-05-03

Top Assignees for applications by Shingo Ohsaka

The entities that hold a legal rights for patent applications filed by inventor Ohsaka Shingo:

Shingo Ohsaka from Hakodate, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of manufacturing semiconductor package including forming a resin sealing member

InventorID:

7518596 ⎘