Barbara Vasquez

City:

Munich

Country:

Germany

Published Applications:

Last publication date:

2005-05-03

Top Assignees for applications by Barbara Vasquez

The entities that hold a legal rights for patent applications filed by inventor Vasquez Barbara:

Barbara Vasquez from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Compliant relief wafer level packaging

Method producing a contact connection between a semiconductor chip and a substrate and the contact connection

InventorID:

7518948 ⎘