Werner K. Robl

City:

Poughkeepsie, New York

Country:

United States

Published Applications:

Last publication date:

2005-03-15

Top Assignees for applications by Werner K. Robl

The entities that hold a legal rights for patent applications filed by inventor Robl Werner K.:

Infineon Technologies AG 1 Munich, Germany

Recent patent applications by Robl Werner K.

Werner K. Robl from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-03-15

US10134617

Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level

InventorID:

7531833 ⎘