Eiichi Ando

City:

Yokohama

Country:

Japan

Published Applications:

Last publication date:

2005-03-08

Top Assignees for applications by Eiichi Ando

The entities that hold a legal rights for patent applications filed by inventor Ando Eiichi:

Eiichi Ando from Yokohama, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Sputtering apparatus and sputter film deposition method

InventorID:

7533624 ⎘