Mark A. Irwin

City:

Tucson, Arizona

Country:

United States

Published Applications:

Last publication date:

2005-03-01

Top Assignees for applications by Mark A. Irwin

The entities that hold a legal rights for patent applications filed by inventor Irwin Mark A.:

Mark A. Irwin from Tucson, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Barrier region and method for wafer scale package (WCSP) devices

InventorID:

7536081 ⎘